lead-free parts pb doc. no : qw0905-LG1030-PF rev. : a date : 11 - mar. - 2006 data sheet tower type led lamps LG1030-PF ligitek electronics co.,ltd. property of ligitek only
+ - 25.0min 0.5 typ note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 60 -60 50% 75% 100%25% 0 25% 75%100% 50% directivity radiation -30 0 30 1.0min 2.54typ part no. LG1030-PF 4.5 8.0 1.5max 3.5 2.5 2.0 package dimensions 4.8 ligitek electronics co.,ltd. property of ligitek only page 1/5
-40 ~ +85 t opr operating temperature peak wave length pnm viewing angle 2 1/2 (deg) note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. gap LG1030-PF green green diffused emittedlens 2.6 30 1.7 565 max. min. 7.560 4.5 min. typ. typical electrical & optical characteristics (ta=25 ) material part no color forward voltage @20ma(v) spectral halfwidth nm luminous intensity @10ma(mcd) storage temperature tstg -40 ~ +100 ma 30 i f forward current reverse current @5v ir peak forward current duty 1/10@10khz power dissipation i fp pd 10 a 120 100 ma mw absolute maximum ratings at ta=25 parameter symbol g ratings unit ligitek electronics co.,ltd. property of ligitek only page 2/5 part no. LG1030-PF
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) page forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip 3/5 part no. LG1030-PF
60 seconds max page 4/5 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only 150 260 c3sec max 260 temp( c) 2 /sec max 100 50 120 25 0 0 preheat 5 /sec max time(sec) dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) part no. LG1030-PF
ligitek electronics co.,ltd. property of ligitek only reference standard mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 description test condition test item reliability test: 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. high temperature storage test low temperature storage test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) operating life test this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. page 5/5 mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs the purpose of this test is the resistance of the device under tropical for hours. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. high temperature high humidity test thermal shock test solder resistance test 1.t.sol=230 5 2.dwell time=5 1sec this test intended to see soldering well performed or not. solderability test 1.t.sol=260 5 2.dwell time= 10 1sec. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. part no. LG1030-PF
|
